Millimeter wave communications with reconfigurable intelligent surfaces: Performance analysis and optimization
Published in IEEE Transactions on Communications, 2021
Recommended citation: Hongyang Du, Jiayi Zhang, Julian Cheng, and Bo Ai, "Millimeter wave communications with reconfigurable intelligent surfaces: Performance analysis and optimization," IEEE Transactions on Communications (Impact Factor: 6.166), vol. 69, no. 4, pp. 2752–2768, Apr. 2021. https://ieeexplore.ieee.org/document/9324795
Recommended citation: Hongyang Du, Jiayi Zhang, Julian Cheng, and Bo Ai, “Millimeter wave communications with reconfigurable intelligent surfaces: Performance analysis and optimization,” IEEE Transactions on Communications (Impact Factor: 6.166), vol. 69, no. 4, pp. 2752–2768, Apr. 2021.